Prep for the Next Supply Chain Glitch With AM May 18, 2021 Additive manufacturing is one way companies can prepare for the next supply chain interruption.
Assisting Small and Medium-Sized Manufacturers with Industry 4.0/Smart Manufacturing Technology Adoption May 14, 2021 Assisting Small and Medium-Sized Manufacturers with Industry 4.0/Smart Manufacturing Technology Adoption
Cybercrime Thrives During Pandemic May 13, 2021 The Verizon Business 2021 Data Breach Investigations Report (2021 DBIR) examines more breaches than ever before, and sheds light on how the most common forms of cyber attacks affected the international security landscape during the global pandemic.
3D Systems Announces Two Acquisitions May 11, 2021 3D Systems announced plans for acquisitions of two companies.
3D Systems Announces Expansion May 4, 2021 3D Systems announced an expansion in Denver to support its health care solutions business and expand application development capabilities for its Application Innovation Group.
Stratasys, DyeMansion Form Alliance May 3, 2021 Stratasys Ltd. and DyeMansion, announced a strategic alliance to create the first reference architecture for production scale additive manufacturing.
Siemens acquires TimeSeries April 28, 2021 Siemens acquisition of TimeSeries to expand Xcelerator portfolio through development of industry-specific apps built on Mendix platform, help customers speed digital transformation through increased adoption of low-code
Sandvik Advances Metals for AM April 28, 2021 Michael Schuisky, AM Business Unit Manager, Sandvik Additive Manufacturing, talked to Manufacturing Engineering about metal 3D printing.
New Tech Offers Improved Drilling Productivity for Steel, Cast Iron April 28, 2021 Holemaking in steel and cast iron up to one inch in diameter is one of the most widely used metalworking processes. What is driving drilling and tapping performance are advances in substrate, coatings, three-flute designs, and combination tools. Just as important are advances in coolant delivery, using different size holes and shapes to facilitate chip evacuation.