Mark 2020 as the year the U.S. government chose to stand up a Manufacturing Innovation Institute focused solely on cybersecurity.
Formlabs, known for its line of desktop stereolithography (SLA) printers, is looking to expand its 3D printing reach with availability of its new Fuse 1 benchtop industrial selective laser sintering (SLS) 3D printer. Under development for nearly seven years, the Fuse 1 marks a notable change for Formlabs as they expand into a new additive manufacturing process.
As more original equipment manufacturers (OEMs) and job shops “warm up” to the idea of laser welding, many have turned their attention to four specific technologies.
Dedicated in-house labs create and optimize laser welding processes for electric motors and batteries.
As I walked through the DMG Mori factory in Davis, Calif., during the company’s Manufacturing Days event in October, there was something noticeably different about it compared to other factories I’ve visited: it was brightly lit and quiet.
Siemens announced today the introduction of Camstar™ Electronics Suite software, an innovative manufacturing execution system (MES) for electronics.
In preparation for mass customization, for starters, Japanese and German tech research officials today committed to expanding their joint work to establish a “social-technical or maybe ‘cyber-social’ environment where ‘digital companions’ and production lines communicate with humans” working in manufacturing, Andreas Dengel said in an interview with Smart Manufacturing magazine here at the CeBIT (Centrum der Büroautomation und Informationstechnologie und Telekommunikation) fair.
Keeping products clean is becoming a more significant part of manufacturing as standards for cleanliness, deburring, and finish grow more stringent.
CyManII brings manufacturers and research institutions together to drive digital infrastructure and security for advanced manufacturing, supply chains and workforce development.
The new material is aimed at streamlining production processes and ultimately reducing costs.