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SLM Solutions Group signs long-term cooperation pact with multi-machine order

LUBECK, GERMANY, June 19, 2017 – SLM Solutions Group AG, a leading supplier of metal-based additive manufacturing technology, signed a long-term cooperation agreement with BeamIT S.p.a., which is based in Fornovo di Taro, Italy. The cooperation concerns the joint development and testing of various parameters for setting the machines when using various metal powders.

Time for Monumental Thinking in Additive

As additive manufacturing emerges from a long infancy, the industry is grappling with a key challenge: A file format and design tools from the 20th century are being asked to do 21st century jobs.

Metal Parts Follow Tough Plastics Act

When you walk into the Redeye On Demand facility in Eden Prairie, MN, you enter into one version of the factory of the future. There you will see a bank of 100 high-end Fortus fused-deposition modeling (FDM) machines from Stratasys that provide the capacity to build real, functional parts with production-grade thermoplastics directly from CAD data.

Micro Manufacturing Keeps Shrinking the Envelope

Micro components continue to shrink in size, demanding ever-greater precision and improved handling of parts with sub-micron-sized features. New approaches in micro machining technology include higher-precision systems from traditional micro machining developers, as well as techniques using additive manufacturing processes and semiconductor wafer-scale technology on the smallest of micro parts.

Let’s Get Wired!

Visibility, uptime, profits, and part quality: why a networked manufacturing floor is no longer a nice-to-have

The Science of Diffusion Bonding or Joining together Dissimilar Metals

Metal diffusion bonding is an essential joining method for achieving a high-purity interface when two similar metals require superior structural integrity. The process involves applying high temperature, and pressure to metals mated together in a hot press causes the atoms on solid metallic surfaces to intersperse and bond.