The COVID-19 pandemic clearly proved challenging to the manufacturing industry in myriad ways. Now, as nations and industries begin to navigate their way forward as restrictions are lifted, manufacturers have an opportunity to put into practice some lessons learned.
NSK America Corp. has upgraded its Ultrasonic Polisher with the Sheenus ZERO. Enhanced features of the Sheenus ZERO Ultrasonic Polisher include an improved, user-friendly design and high efficiency power, according to the company.
Suppliers of cleaning, safety, and environmental equipment are promoting a common message—good housekeeping is not only good for your workforce, it’s also good for the shop’s balance sheet.
The Injection Molding Machine Interface (IMMI) is made for plastics manufacturers to integrate Universal Robots with injection molding machines.
Fair Lawn, NJ. Sean Holt, head of Sales Area Americas for Sandvik Coromant, announced a new Sandvik Coromant Center will open in Mebane, NC, a geography heavy with aerospace and automotive manufacturing and a strong culture of innovation.
When it comes to the production of high-precision parts for industries ranging from aerospace to medical, grinding remains the best, most cost-effective approach to obtaining fine surface finishes and tight tolerances.
Sometimes, improving the quality of machined parts does not involve machining. That’s what A.R. Machining, a family-owned supplier to the aerospace, gas and semi-conductor industries, discovered.
Many industries have been making parts with micron dimensions for some time, but in the last few years, the market for miniaturization has expanded. The demand is not only for small parts, but also for small complex features on larger parts. This is due chiefly to the switch to modules in which the functions of several parts or subsystems are not handled by a single complex unit.
President Biden's $15.5 billion investment drives a clean energy revolution, revitalizing auto manufacturing and accelerating the electric vehicle transition.
Ultimately, the best way to improve semiconductor packaging may be to eliminate the traditional package altogether.