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Ready for Ransomware?

The nexus of cyber and physical security threats is the stuff of nightmares, and while manufacturers are waking up to it as a reality, experts worry that the awakening is happening too slowly.

Comau, Microsoft, ICONICS Target Efficiency Together

Comau, Microsoft and ICONICS are debuting here at Hannover Messe the results of their work together to improve manufacturing production around the world, in terms of efficiency and total cost of ownership.

Mitutoyo America Opens New Facility in Detroit Area

Mitutoyo America Corp. (MAC; Aurora, IL) celebrated the grand opening of its new Detroit-area M3 Solution Center in Novi, MI, on June 28. The 8455 ft2 (785.5 m2) facility replaces one that the company had occupied for 38 years in nearby Plymouth, MI.

Renishaw Inc. Moves to New Headquarters

Renishaw Inc. is preparing to move into a new 133,000-sq.-ft. office and warehouse facility in West Dundee, IL, about 40 miles from Chicago. The two-story facility will be the company’s new North American headquarters, but also includes space for product development, testing, warehousing and distribution. It includes the new U.S. Additive Manufacturing Solutions Center – part of Renishaw’s network of global Solutions Centers, opening over the next year.

The Science of Diffusion Bonding or Joining together Dissimilar Metals

Metal diffusion bonding is an essential joining method for achieving a high-purity interface when two similar metals require superior structural integrity. The process involves applying high temperature, and pressure to metals mated together in a hot press causes the atoms on solid metallic surfaces to intersperse and bond.

Sandvik Creates More Sustainable Packaging

Sandvik Coromant’s Package Selector Application analyzes a 3D CAD model of a product and recommends the smallest packaging possible using an AI algorithm that calculates the product’s rotation.