The COVID-19 black swan event disrupted the global economy and forced companies to rapidly rethink their processes, operations and supply networks.
To get to smart manufacturing, the industry needs integration, simulation and analysis.
Like the United Nations’ international delegates who use interpreters to understand each other, robots, machines and other industrial components from various vendors speak different computer languages and need translators to help them communicate.
LIFT recently expanded the focus of its desire to “create innovations faster, better and cheaper” to the materials, processes and systems involved in moving innovations from concept to commercialization.
Most manufacturing executives participating in a survey said cybersecurity threats are beginning to overwhelm their resources.
IPG Photonics Corp. has launched LightWELD, a new handheld laser welding system. The LightWELD product line enables fabricators to benefit from the greater flexibility, precision and ease of use enabled by laser-based solutions over traditional welding products, according to IPG Photonics.
The producers of FABTECH have launched a three-part webinar series that includes an expert line-up of visionary speakers sharing insights and predictions for the economic future covering the impact of the current state of affairs; pre and post-election insights and predictions for the future.
The Verizon Business 2021 Data Breach Investigations Report (2021 DBIR) examines more breaches than ever before, and sheds light on how the most common forms of cyber attacks affected the international security landscape during the global pandemic.
Better wheels and more capable machines add to grinding’s edge on tough materials
Holemaking in steel and cast iron up to one inch in diameter is one of the most widely used metalworking processes. What is driving drilling and tapping performance are advances in substrate, coatings, three-flute designs, and combination tools. Just as important are advances in coolant delivery, using different size holes and shapes to facilitate chip evacuation.