Texas Instruments marked a significant milestone with the groundbreaking ceremony for its new 300-mm semiconductor wafer fabrication plant (fab), LFAB2, in Lehi, Utah last week. The event was attended by Utah Governor Spencer Cox, local elected officials and community leaders, along with TI's President and CEO, Haviv Ilan.
LFAB2 will be an extension of TI's existing 300-mm wafer fab in Lehi, and together, they will manufacture tens of millions of analog and embedded processing chips daily at full production capacity. The new fab represents a vital part of TI's long-term manufacturing strategy to meet the evolving needs of its customers.
TI's commitment to expanding its manufacturing footprint in Utah was demonstrated earlier this year when the company announced an $11 billion investment in the state, marking the largest economic investment in Utah's history. LFAB2 is expected to create around 800 direct jobs at TI and thousands of indirect jobs in the community, with initial production potentially available by 2026.
Haviv Ilan, TI's President and CEO, highlighted the company's mission to make electronics more affordable through semiconductors, emphasizing the importance of manufacturing analog and embedded processing semiconductors.
As part of its commitment to education, TI will invest $9 million in the Alpine School District to establish Utah's first Science, Technology, Engineering and Math (STEM) learning community for K-12 students. This initiative will integrate STEM concepts into the district's curriculum, provide STEM-focused professional development for educators, and equip students with essential skills.
TI is dedicated to sustainability and environmental responsibility. LFAB2 aims to achieve LEED Gold version 4 certification, with a goal of operating on 100 percent renewable electricity. The new fab will incorporate advanced 300-mm equipment and processes to reduce waste, water, and energy consumption, with an emphasis on water recycling.
LFAB2 will be an essential component of TI's semiconductor manufacturing expansion, which also includes four new 300-mm wafer fabs in Sherman, Texas. These investments, combined with potential support from the CHIPS and Science Act, ensure a reliable supply of analog and embedded processing products and underline TI's commitment to long-term capacity planning.
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