Prima Power Laserdyne recently presented a Zeiss high-resolution microscope to the welding program leaders of Anoka Technical College as the college expands its robotic and laser welding program.
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Felsomat USA will host Innovation Day on June 10 at its U.S. headquarters in Schaumburg.
Designing new aerospace engines is challenging, but Rolls-Royce Germany turned to data analytics and AI to meet these challenges. The results? Reduced costs and shortened lead times.
The increased use of CT scanning for metal powder bed fusion parts is usually associated with high-value parts and elevated quality requirements. There are increased requests for CT scanning on parts made of engineering-grade polymers like PEEK, PEKK or ULTEM and for fiber-reinforced composites like Nylon 12 CF.
The industry’s fastest growing firms are leveraging new artificial intelligence (AI), blockchain and Internet of Things (IoT) solutions to transform supply chains, transport and logistics. Reliance on paper forms and clashing systems are giving way to improved transparency across the value chain.
At a Tier 1 automotive manufacturer in Mexico, it quickly became clear that AI in the factory was a fantastic solution to help human workers achieve greater levels of success; a human plus machine scenario where AI enhances the capabilities of, rather than replaces, human workers.
Machine shops use a variety of techniques to track the condition of their cutting tools, ranging from simple to sophisticated. No matter what monitoring method is used, it can be crucial in preventing catastrophic tool failure. At its best, monitoring also significantly boosts tool life and slashes tooling costs.
AI already helps individual factories improve production, safety, efficiency and other metrics while lowering costs. Marrying AI and cloud technology can supercharge those benefits.
The newly developed 5-axis portal milling machines of the FZP Series from Zimmermann are compact, flexible and highly accurate. This is ensured by the thermosymmetrical design with center-guided Z-slide.
Integrate lasers onto PICs? Use silicon to make PICs? Co-package optics with electronics? This institute is tackling it all.