Journal of Manufacturing Systems Editorial Board Editor-in-Chief L. WangKTH Royal Institute of Technology Stockholm, Sweden Associate Editors O. BattaiaISAE-Supaero, Toulouse, France A. DiabatNew York University Abu Dhabi, Abu Dhabi, United Arab Emirates M. DoolanAustralian National University, Canberra, Australian Capital Territory, Australia M. FreitagUniversität Bremen, Bremen, Germany J. KoAjou University, Suwon, The Republic of Korea B. KulvatunyouNational Institute of Standards and Technology (NIST), Gaithersburg, Maryland, USA Editorial Board S. AkpinarDokuz Eylül University, Izmir, Turkey B. BabicUniversity of Belgrade, Belgrade, Serbia R. BabiceanuEmbry Riddle Aeronautical University, Daytona Beach, Florida, USA T. BeckerUniversität Bremen, Bremen, Germany E. BottaniUniversità degli Studi di Parma, Italy C. ChandraUniversity of Michigan at Dearborn, Dearborn, Michigan, USA Q. ChangStony Brook University, Stony Brook, New York, USA N. ChenNational University of Singapore, Singapore, Singapore D. M. D'AddonaUniversity of Naples Federico II, Napoli, Italy E. FrazzonUniversidade Federal de Santa Catarina, Florianopolis, Brazil A. GiretUniversitat Politècnica de València, Valencia, Spain W. GuoState University of New Jersey, New Jersey, USA J. HegerLeuphana Universität Lüneburg, Lüneburg, Germany S. HuangUniversity of Washington, Washington, District of Columbia, USA V. JainVictoria University of Wellington, Wellington, New Zealand M. B. KurzClemson University, Clemson, South Carolina, USA Emeritus Editors J.G. BollingerUniversity of Wisconsin at Madison, Madison, Wisconsin, USA R. SuriUniversity of Wisconsin at Madison, Madison, Wisconsin, USA J.T. BlackAuburn University, Auburn, Alabama, USA S. KumarUniversity of St Thomas, Minneapolis, Minnesota, USA J. LiuUniversity of Arizona, Tucson, Arizona, USA V. PrabhuPennsylvania State University, University Park, Pennsylvania, USA K. SalonitisCranfield University, Cranfield, Bedfordshire, England, UK A. SyberfeldtUniversity of Skövde, Skovde, Sweden S. YangXi'an Jiaotong University, Xi'an, Shaanxi, China S. LeeUniversity of Miami, Miami, Florida, USA A. NassehiUniversity of Bristol, Bristol, England, UK A. NgUniversity of Skövde, Skövde, Sweden P. RaoUniversity of Nebraska at Lincoln, Lincoln, Nebraska, USA J. L. RickliWayne State University (WSU), Detroit, Michigan, USA D. RoyIndian Institute of Management Ahmedabad (IIMA), Gujarat, India J. SagawaUniversidade Federal de São Carlos, São Carlos, Brazil M.K. ThompsonGE Additive, West Chester, Ohio, USA A. ValenteScuola Universitaria Professionale della Svizzera Italiana (SUPSI), Manno, Italy K. WangTsinghua University, Beijing, China P. WangUniversity of Illinois at Urbana-Champaign, Urbana, Illinois, USA X. V. WangKTH Royal Institute of Technology, Stockholm, Sweden L. WellsWestern Michigan University, Kalamazoo, Michigan, USA D. WuUniversity of Central Florida, Orlando, Florida, USA T. WuestWest Virginia University, Morgantown, West Virginia, USA H. YangPennsylvania State University, Pennsylvania, USA V. Jorge LeonTexas A&M University, College Station, Texas, USA S.J. HuUniversity of Michigan, Ann Arbor, Michigan, USA N. DuffieUniversity of Wisconsin at Madison, Madison, Wisconsin, USA
Associate Editors O. BattaiaISAE-Supaero, Toulouse, France A. DiabatNew York University Abu Dhabi, Abu Dhabi, United Arab Emirates M. DoolanAustralian National University, Canberra, Australian Capital Territory, Australia M. FreitagUniversität Bremen, Bremen, Germany J. KoAjou University, Suwon, The Republic of Korea B. KulvatunyouNational Institute of Standards and Technology (NIST), Gaithersburg, Maryland, USA Editorial Board S. AkpinarDokuz Eylül University, Izmir, Turkey B. BabicUniversity of Belgrade, Belgrade, Serbia R. BabiceanuEmbry Riddle Aeronautical University, Daytona Beach, Florida, USA T. BeckerUniversität Bremen, Bremen, Germany E. BottaniUniversità degli Studi di Parma, Italy C. ChandraUniversity of Michigan at Dearborn, Dearborn, Michigan, USA Q. ChangStony Brook University, Stony Brook, New York, USA N. ChenNational University of Singapore, Singapore, Singapore D. M. D'AddonaUniversity of Naples Federico II, Napoli, Italy E. FrazzonUniversidade Federal de Santa Catarina, Florianopolis, Brazil A. GiretUniversitat Politècnica de València, Valencia, Spain W. GuoState University of New Jersey, New Jersey, USA J. HegerLeuphana Universität Lüneburg, Lüneburg, Germany S. HuangUniversity of Washington, Washington, District of Columbia, USA V. JainVictoria University of Wellington, Wellington, New Zealand M. B. KurzClemson University, Clemson, South Carolina, USA Emeritus Editors J.G. BollingerUniversity of Wisconsin at Madison, Madison, Wisconsin, USA R. SuriUniversity of Wisconsin at Madison, Madison, Wisconsin, USA J.T. BlackAuburn University, Auburn, Alabama, USA S. KumarUniversity of St Thomas, Minneapolis, Minnesota, USA J. LiuUniversity of Arizona, Tucson, Arizona, USA V. PrabhuPennsylvania State University, University Park, Pennsylvania, USA K. SalonitisCranfield University, Cranfield, Bedfordshire, England, UK A. SyberfeldtUniversity of Skövde, Skovde, Sweden S. YangXi'an Jiaotong University, Xi'an, Shaanxi, China S. LeeUniversity of Miami, Miami, Florida, USA A. NassehiUniversity of Bristol, Bristol, England, UK A. NgUniversity of Skövde, Skövde, Sweden P. RaoUniversity of Nebraska at Lincoln, Lincoln, Nebraska, USA J. L. RickliWayne State University (WSU), Detroit, Michigan, USA D. RoyIndian Institute of Management Ahmedabad (IIMA), Gujarat, India J. SagawaUniversidade Federal de São Carlos, São Carlos, Brazil M.K. ThompsonGE Additive, West Chester, Ohio, USA A. ValenteScuola Universitaria Professionale della Svizzera Italiana (SUPSI), Manno, Italy K. WangTsinghua University, Beijing, China P. WangUniversity of Illinois at Urbana-Champaign, Urbana, Illinois, USA X. V. WangKTH Royal Institute of Technology, Stockholm, Sweden L. WellsWestern Michigan University, Kalamazoo, Michigan, USA D. WuUniversity of Central Florida, Orlando, Florida, USA T. WuestWest Virginia University, Morgantown, West Virginia, USA H. YangPennsylvania State University, Pennsylvania, USA V. Jorge LeonTexas A&M University, College Station, Texas, USA S.J. HuUniversity of Michigan, Ann Arbor, Michigan, USA N. DuffieUniversity of Wisconsin at Madison, Madison, Wisconsin, USA