Associate Editors

M. Annoni
Politecnico di Milano, Milano, Italy

W. Cai
GM Global R&D, Warren, Michigan, USA

G. Cheng
Purdue University, West Lafayette, Indiana, USA

K. Chou
University of Louisville, Louisville, Kentucky, USA

J. Dong
North Carolina State University, Raleigh, North Carolina, USA

A. Elwany
Texas A&M University, College Station, Texas, USA

Z. Feng
Oak Ridge National Laboratory

P. Guo
Northwestern University, Evanston, Illinois, USA

G.Y. Kim
Iowa State University, Ames, Iowa, USA

A.S Kumar
National University of Singapore, Singapore

J.J Li
Pennsylvania State University, Pennsylvania, USA

X. Li
University of Wisconsin at Madison, Madison, Wisconsin, USA

J. Ma
Saint Louis University, Saint Louis, Missouri, USA

A.S. Malik
University of Texas at Dallas, Richardson, Texas, USA

C. Nath
Hitachi America, Farmington Hills, Michigan, USA

G. Ngaile
North Carolina State University, Raleigh, North Carolina, USA

S.S. Park
University of Calgary, Calgary, Alberta, Canada

J. Samuel
Rensselaer Polytechnic Institute, New York, USA

M. Strano
Politecnico di Milano, Milano, Italy

M. Sundaram
University of Cincinnati, Cincinnati, Ohio, USA

B. Wu
Purdue University, West Lafayette, Indiana, USA

H. Yamaguchi Greenslet
University of Florida, Gainesville, Florida, USA

F. Yang
University of Kentucky, Lexington, Kentucky, USA

Y. Zhang
University of Kentucky, Lexington, Kentucky, USA