Sponsored by the Direct Digital Manufacturing Tech Group, which is part of SME’s Additive Manufacturing Community
University of Waterloo
Team Members:
Gitanjali Shanbhag
Lisa Brock
Advisor:
Dr. Mihaela Vlasea
Winning Design: The Copper Cooler: Heat Sink for CPUs
The University of Waterloo team investigated the redesign of a heat sink for cooling central processing units (CPUs). The new heat sink features an organic, branched fin design revolved around a circular base which is situated on top of the CPU. It will be part of an assembly with a fan mounted above the heat sink to facilitate forced convection, making it an active heat sink system.
University of Waterloo
Team Members:
Alexander Martinez-Marchese
Sagar Patel
Pablo Enrique
Advisor:
Mihaela Vlasea
Co-Runner Up Design: Topology Optimized Wind Turbine Blades Using Sustainable Biomaterials
The Ohio State University
Team Members:
Alark Choudhary
Isaac Flemming
Hitansh Singhal
Sujith Srinivaas
Advisor:
Dr. Allen Yi
Co-Runner Up: Customized Phone Case Designed For Thermal Efficiency