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Product Title: Rapid Prototyping of High Density Circuitry

Updated from Personify: 2013-08-12

Personify Product Code: TP04PUB221

Personify Product ID:       127171

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Author: Mr Phillip L Gallegos, Mr Don W Davis, Mr Bart D Chavez, Jeremy Palmer, Ryan Wicker, P Yang, Francisco Medina Jr

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Published Date: 2004-07-13

Page Count: 10

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Product Type:   TECHPAPER

 

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Description:

A new manufacturing process is under development at Sandia National Laboratories to integrate stereolithography (SL) and direct-write (DW) technology for the fabrication of three-dimensional, high-density circuits. This research focuses on techniques to (1) fixture and re-register SL builds to encapsulate electrical devices, such as switches and connectors, and (2) eliminate manual wiring in favor of automated deposition and encapsulation of high-density circuit materials within structural members. Details of trials to apply the new techniques to construct a sample electrical junction box are presented. The result of this work is intended to demonstrate the feasibility of rapidly manufactured, integrated and fully functional electromechanical systems that are more compact, less expensive and more reliable than their conventional predecessors. Authors: J. A. Palmer (Sandia National Laboratories, Albuquerque, NM), P. Yang (Sandia National Laboratories, Albuquerque, NM), D. W. Davis (Sandia National Laboratories, Albuquerque, NM), B. D. Chavez (Sandia National Laboratories, Albuquerque, NM), P. L. Gallegos (Sandia National Laboratories, Albuquerque, NM), R. B. Wicker (University of Texas, El Paso, TX), F. R. Medina (University of Texas, El Paso, TX).

 

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