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C.P. Wong, PhD, Charles Smithgall Institute Endowed Chair and Regents' Professor, School of Materials Science and Engineering at Georgia Institute of Technology. Wong joined Georgia Tech in 1996 as a professor in the School of Materials Science and Engineering and as a research director of the NSF Packaging Research Center. His research interests lie in the fields of polymeric materials, materials reaction mechanism, IC packaging, in particular, hermetic equivalent plastic packaging processes, interfacial adhesions, PWB, SMT assembly and components reliability. |
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R. Wayne Johnson, PhD, professor of electrical engineering at Auburn University and director of the Laboratory for Electronics Assembly and Packaging. At Auburn, he has established teaching and research laboratories for advanced packaging and electronics manufacturing. His research efforts are focused on the materials, processing and reliability aspects of electronics manufacturing. |
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Ndy Ekere, PhD, head of Medway School of Engineering at the University of Greenwich and leader of the university's Electronics Manufacturing Engineering Research Group. His most recent work has concentrated on identifying, exploring and developing suitable assembly and packaging technologies to meet the challenges of miniaturization facing the electronics industry and supporting virtual development of new and low-cost electronic products. |
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Dongkai Shangguan, PhD, senior director of Advanced Assembly & Environmental Technologies, Flextronics. Shangguan received the award for his pioneering efforts on lead-free solder joint reliability, currency of electronics manufacturing publications, involvement in electronics manufacturing technical events and a high level of patented works. He has 19 U.S. and international patents issued and a number of U.S. and international patents pending. |
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John H. Lau, PhD, Agilent Technologies Inc. Lau has been working in soldering science and technology since 1983, first for Hewlett-Packard Co. and then for Agilent Technologies Inc. He helped both companies' design and develop their IC packages and electronic assembly processes, while ensuring the quality and reliability of their products. |
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George G. Harman, a fellow of the National Institute of Standards and Technology, dean of staff, was honored for his outstanding 40-year career as a lecturer, author, editor, visiting scientist and teacher of microelectronics assembly and packaging technology. |
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Mauro Walker, retired senior vice president and Motorola director of manufacturing. Walker was the founding chairman of the National Electronic Manufacturing Initiative, which is an organization of some 60 North American electronic equipment manufacturers and their suppliers dedicated to "improving the competitiveness of North American electronic manufacturing companies." |
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Michael J. Kelly, PhD, Northrop Grumman endowed chair of manufacturing and design at California State University, Los Angeles. Kelly was significantly involved with the design of IBM's advanced manufacturing electron beam system as well as the development of the Advanced Statistical Transient Analysis program. |
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Rao R. Tummala, PhD, pettit chair professor and director of the Packaging Research Center, Georgia Institute of Technology, was recognized for his many years of contribution, such as pioneering multichip packaging in electronics, reinforced by his enthusiastic stewardship of world-class quality and visionary insight. |
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Arati Prabhakar, PhD, director of the National Institute of Standards and Technology. Prior to her role at NIST, Prabhakar was the director of the Microelectronics Technology Office in the Defense Department's Advanced Research Projects Agency where she had managed advanced electronics research since 1986. |
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Craig Barrett, executive vice president and chief operating officer, Intel Corp., was recognized for his entrepreneurial spirit, leadership and innovation in connection with his years of service at Intel. |
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Paul Allaire, chairman and CEO, Xerox Corp. Allaire contributed greatly to Xerox's resurgence as a top-quality, low-cost competitor in the computer industry. He guided the company into the global marketplace with an aggressive strategic plan. |
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John Young, retired president and chief executive officer of Hewlett-Packard Co. During his 34-year career with HP, Young was a major contributor to the company's worldwide leadership in electronics manufacturing. |
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Robert W. Galvin, chairman of the Executive Committee of Motorola Inc., helped lead Motorola to win the Malcolm Baldridge National Quality Award in 1988. |