Global economic pressures are driving companies to reduce costs, improve yields, and drive flexible capacity to increase profitability. The new 450 mm wafer has significant barriers to entry based on the developments of new technology, and the cost of capital to support that technology. These barriers are causing some companies to push forward, while others continue to invest in known technologies with the hope of integrating the 450 mm technologies at a later date. The transformation from current semiconductor wafer processing to a 450 mm wafer is driving a need for a faster breakeven point and better returns on invested capital. This will be accomplished through predictive and preventive systems integrated into a flexible facility that adapts to changing requirements and technologies.