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Clearing the Springback Hurdle

Author(s)/Editor(s): Eric Kam

Pages in Print Edition: 11PP

Published: 12/31/2009
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SME Members: $ 0.00
Non members: $ 15.00


~ 2010 FFC Technical Paper Excellence Award Winner ~ Among the challenges that face today's stamping professionals--competitive environment, increasing cost of materials, complex product designs, new materials, shorter project deadlines--springback is consistently listed among the hurdles or barriers to success. Springback, a long-time challenge to stampers, complicates nearly all of the challenges that face the business today and appears to be the "Holy Grail" of stamping technology.

Addressing springback is a multifaceted and complex challenge. The use of computer-aided engineering has made achieving safe panels a seemingly elementary exercise, however, dimensional accuracy is still somewhat elusive. Springback is not a new phenomena introduced only by the use of high-strength and exotic materials, but instead is a certainty for all stamped metals--a certainty that once properly understood can be addressed with great success.

Presented at: FABTECH International & AWS Welding Show, Including METALFORM, November 15-18, 2009, Chicago, IL.